時間

項目

說明

6/21前

摘要截稿

請至www.impact.org.tw上傳投稿，英文400-500字【F】

7/14前

入選通知

發信通知摘要入選者

8/16前

議程公告

將於IMPACT網站公告論文所屬場次，參賽者均須報名繳費

8/25前

全文截稿

請上傳至www.impact.org.tw，英文全文4頁【F】

IEEE版權

提供IEEE Form，論文便可收錄至IEEE Xplore【F】

9/28前

得獎通知

發信通知得獎者

10/25-10/27

論文發表

(TPCA Show & IMPACT)

書面：於TPCA Show《PCB優秀論文主題區》海報呈現【F】

口頭：於IMPACT Conference英文口語發表【F】

有入圍但無得獎者，於IMPACT Conference進行論文發表(配合大會通知之Oral或Poster安排)

10/25

頒獎典禮

請得獎者出席TPCA公開活動進行領獎

代碼

領域

B1

Advanced and Green Materials and Process｜先進與綠色製造材料製程

Green materials (Lead-free, halogen-free, energy saving, recycling and reducing etc.) , Green process and manufacturing , Millimeter-wave materials(low Dk/Df etc.), Low CTE and low water absorption materials, Thermal dissipation materials, Photo and non-photo dielectric materials for high density circuits, and Advanced substrate materials and process.

B2

Test, Quality, Inspection and Reliability｜測試、品質、自動光學檢測、可靠度技術

Feature testing and verification, Inspection(AOI, non-destructive testing etc.), Electrical measurement and evaluation, Structure integrity, and Failure mechanism analysis.

B3

HDI, IC Substrate and FPC Technology｜高密度互連技術、IC載板及軟板

SAP and m-SAP process(fine pitch line), Build-up board, Micro-vias and copper plating process, Multilayer core and coreless, Embedded substrate, Advanced flex and rigid-flex, High speed and high frequency circuitry and substrate, and High power and thermal dissipation substrate.

B4

Smart Manufacturing and Automation｜智慧製造及自動化相關

Mechatronics, Robotics, Control systems, Tele-robotics, Human computer(robot) interaction, Modeling and simulation techniques, Intelligent control and manufacturing, Neuro-control, Fuzzy control and their applications, Automatic control system, and Process integration.

獎項

名額

獎金

金獎

1名

6萬元、獎座、獎狀

銀獎

1名

4萬元、獎座、獎狀

優等

1~2名

2萬元、獎座、獎狀